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ESD/EMI Protection for Color LCD Interfaces
PROTECTION PRODUCTS - EMIClampTM Description
The EClampTM2398P is a low pass (L-C) filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of color LCD and camera lines in cellular phones and other portable electronics. The device consists of eight identical circuits comprised of TVS diodes for ESD protection, and a 5-pole inductor - capacitor network for EMI/RFI filtering. A typical inductor value of 19nH and a capacitor value of 12pF are used to achieve 30dB minimum attenuation from 800MHz to 2.7GHz. The TVS diodes provide effective suppression of ESD voltages in excess of 15kV (air discharge) and 8kV (contact discharge) per IEC 61000-4-2, level 4. The EClamp2398P is in a 16-pin, RoHS/WEEE compliant, SLP4016P16 package. It measures 4.0 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and PDAs.
EClamp2398P
PRELIMINARY
Features
Bidirectional EMI/RFI filter with integrated TVS for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4, 15kV (air), 8kV (contact) Filter performance: 30dB minimum attenuation 800MHz to 2.7GHz TVS working voltage: 5V Inductor: 19nH (Typical) Capacitance: 12pF (Typical at VR = 2.5V) Protection and filtering for eight lines Solid-state technology
Mechanical Characteristics
SLP4016P16 16-pin package RoHS/WEEE Compliant Nominal Dimensions: 4.0 x 1.6 x 0.58 mm Lead Pitch: 0.5mm Lead finish: NiPd Marking: Marking Code Packaging: Tape and Reel per EIA 481
Applications
Color LCD Protection Cell Phone CCD Camera Lines Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
4.00
12
L1
L2
IN
C1 C2 C3
OUT
1.60
0.50 BSC
GND
0.58
Device Schematic (8X)
Revision 1/18/2006
16 Pin SLP package (Bottom Side View) Nominal Dimensions in mm
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EClamp2398P
PROTECTION PRODUCTS Maximum Ratings
R ating ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Junction Temp erature Op erating Temp erature Storage Temp erature Symbol VESD TJ Top TSTG Value +/- 20 +/- 15 125 -40 to +85 -55 to +150
PRELIMINARY
Units kV
o
C C C
o
o
Electrical Characteristics (T=25oC)
P a r a met er T VS Reverse Stand-Of f Voltage T VS Reverse Breakdown Voltage T VS Reverse Leakage Current DC Resistance Filter Cut-Of f Frequency Inductance Total Series Inductance Capacitance Total Capacitance Symb ol VRWM VBR IR RDC fc L L1 + L2 C1 , C2 , C3 C1 + C2 + C3 Each Line VR = 2.5V, f = 1MHz Input to Gnd, Each Line VR = 2.5V, f = 1MHz 10 30 ZSource = ZLoad = 50 Ohms It = 1mA VRWM = 3.3V 18 150 19 38 12 36 15 45 6 8 C on d i t i on s Mi n i mu m Ty p i c a l M a xi m u m 5 10 0.1 Un i ts V V A Ohms MHz nH nH pF pF
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EClamp2398P
PROTECTION PRODUCTS Typical Characteristics
Typical Insertion Loss S21 (Each Line)
CH1 S21 LOG 6 dB / REF 0 dB 1: -33.132 dB 800 MHz 2: -36.460 dB 1.8 GHz 3: -31.558 dB 3 GHz
CH1 S21 LOG 20 dB /REF 0 dB
PRELIMINARY
Analog Crosstalk (Each Line)
0 dB -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB -42 dB -48 dB -54 dB 1 MHz START . 030 MHz 10 MHz 100 MHz
1 2 3
3 1 GHz GHz STOP 3000. 000000 MHz
START. 030 MHz
. STOP 3000 000000 MHz
ESD Clamping (+8kV Contact)
ESD Clamping (-8kV Contact)
Capacitance vs. Reverse Voltage (Normalized to 2.5 volts)
2
1.5
CJ(VR) / CJ(VR=0)
1
0.5
f = 1 MHz 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Reverse Voltage - VR (V)
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EClamp2398P
PROTECTION PRODUCTS Applications Information
Device Connection The EClamp2398P is comprised of eight identical circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is in a 16-pin SLP package. Electrical connection is made to the 16 pins located at the bottom of the device. A center tab serves as the ground connection. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Recommendations for the ground connection are given below. Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering performance of the device. As frequency increases, the effect of the inductance becomes more dominant. This effect is given by Equation 1. Equation 1: The Impedance of an Inductor at Frequency XLF
PRELIMINARY
Figure 1 - Pin Identification and Configuration (Top Side View)
In 1 In 2 In 3 In 4 In 5 In 6 In 7 In 8
Pin 1-8 9 - 16 Center Tab
1
16
Gnd
8
9
Out 1 Out 2 Out 3 Out 4 Out 5 Out 6 Out 7 Out 8
Identification Inp ut Lines Outp ut Lines Ground
XLF( L, f ) = 2 * * f * L
Where: L= Inductance (H) f = Frequency (Hz) Via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in Figure 2. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Bringing the ground plane closer to the signal layer (preferably the next layer) also reduces ground loop inductance. Multiple vias in the device ground pad will result in a lower inductive ground loop over two exterior vias. Vias with a diameter d are separated by a distance y run between layers separated by a distance x. The inductance of the loop path is given by Equation 2. Thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics.
Figure 2 - Inductance of Rectangular Wire Loops
Ground Via 1 x
Ground Via 2 d Signal Layer
y
Ground Layer Layer
Equation 2: Inductance of Rectangular Wire Loop
LRECT(d, x , y) = 10.16 *10 -9 * x * ln
Where: d = Diameter of the wire (in) x = Length of wire loop (in) y = Breath of wire loop (in)
[
[ ] + y * ln[ ]]
2*y d 2*x d
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EClamp2398P
PROTECTION PRODUCTS Applications Information
Figure 3 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in Equation 2 in highly insensitive to parameter d) . Figure 4 shows a typical insertion loss (S21) plot for the device using Semtech's filter evaluation board with 50 Ohm traces and the recommended via configuration. Figure 3 - Recommended Layout Using Ground Vias
PRELIMINARY
Figure 4 - Filter Characteristics Using Recommended Layout with Internal Vias
CH1 S21 LOG 6 dB / REF 0 dB 1: -4.1029dB 150 MHz
4
0 dB -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB -42 dB -48 dB -54 dB 1 MHz START . 030 MHz 10 MHz
2: -34.337 dB 800 MHz 3: -37.930 dB 1.8 GHz 4: -34.395 dB 2.5 GHz
1 2
3
100 MHz
3 1 GHz GHz STOP 3000. 000000 MHz
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EClamp2398P
PROTECTION PRODUCTS Applications Information - Spice Model
EClamp2398P Spice Model & Parameters
PRELIMINARY
Line In
1.4nH
L
38nH
1.4nH
Line Out
Figure 1 - EClamp2398P Spice Model
Table 1 - EClamp2398P Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 4.09E-15 7.435 0.743 0.584 1E-3 31.3E-12 2.541E-9 0.23 1.1 1.11 D2 (T VS) 4.09E-15 7.435 0.743 0.584 1E-3 31.3E-12 2.541E-9 0.23 1.1 1.11
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EClamp2398P
PROTECTION PRODUCTS Outline Drawing - SLP4016P16 PRELIMINARY
A
D
B
DIM
PIN 1 INDICATOR (LASER MARK) E
A aaa C A2 1 E1 N e D/2 2 LxN E/2 A1 C
SEATING PLANE
A A1 A2 b D D1 E E1 e L N aaa bbb
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .023 .026 0.50 0.58 0.65 .000 .001 .002 0.00 .003 0.05 (.006) (0.15) .007 .010 .012 0.20 0.25 0.30 .153 .157 .161 3.90 4.00 4.10 .122 .126 .130 3.10 3.20 3.30 .059 .063 .067 1.50 1.60 1.70 .010 .016 .020 0.25 0.40 0.50 0.50 BSC .020 BSC .011 .013 .015 0.28 0.33 0.38 16 16 .003 0.08 .004 0.10
bxN bbb CAB
NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP4016P16
P X
DIM B C F G P X Y Z DIMENSIONS INCHES MILLIMETERS .130 3.30 .060 1.52 .018 0.45 .035 0.89 .020 0.50 .012 0.30 .025 0.63 .085 2.15
Z
G
F
(C)
Y
B
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET
2006 Semtech Corp.
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EClamp2398P
PROTECTION PRODUCTS Marking PRELIMINARY Ordering Information
Part Number Qty per Reel 3000 R eel Size 7 Inch
PIN 1 INDICATOR (LASER MARK)
2398P
EClamp 2398P.TCT
EMIClamp and EClamp are marks of Semtech Corporation
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0 1.78 +/-0.10 mm B0 4.30 +/-0.10 mm K0 0.74 +/-0.10 mm
Tape Width
B, (Max)
D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000)
D1
E 1.750.10 mm (.069.004)
F
K (MAX)
P 4.00.1 mm (.157.004)
P0 4.00.1 mm (.157.004)
P2
T(MAX)
W 12.0 mm + 0.3 mm - 0.1 mm (.472.012)
12 mm
8.2 mm (.476)
1.0 mm 0.05 (.039)
5.50.05 mm (.217.002)
4.5 mm (.177)
2.00.05mm (.079.002)
0.4 mm (.016)
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
2006 Semtech Corp. 8 www.semtech.com

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